CIN::APSE®
CIN::APSE®

CIN::APSE®

CIN::APSE solderless, high density, custom interconnects are used for board to board, IC to board, flex to board and component to board applications. CIN::APSE is the most widely implemented crimpless and solderless, high speed, interconnect in the industry. The simple 2-piece, patent protected design enables 50+ Gbps, and wide range of profiles from 0.020” to 1.0”. CIN::APSE contacts are available in 0.5 mm and 1.0 mm diameters with a standard pitch of 1.0 mm or greater. The number of contacts is not limited and the largest connector implemented to date contained 7,396 I/Os. Solderless termination is achieved through compression and the unique contact design assures multiple points of contact per I/O. The CIN::APSE interconnects have proven reliability under the most extreme mechanical shock and vibration.

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CIN::APSE solderless, high density, custom interconnects are used for board to board, IC to board, flex to board and component to board applications. CIN::APSE is the most widely implemented crimpless and solderless, high speed, interconnect in the industry. The simple 2-piece, patent protected design enables 50+ Gbps, and wide range of profiles from 0.020” to 1.0”. CIN::APSE contacts are available in 0.5 mm and 1.0 mm diameters with a standard pitch of 1.0 mm or greater. The number of contacts is not limited and the largest connector implemented to date contained 7,396 I/Os. Solderless termination is achieved through compression and the unique contact design assures multiple points of contact per I/O. The CIN::APSE interconnects have proven reliability under the most extreme mechanical shock and vibration.

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Product Overview

CIN::APSE

CIN::APSE Connectors

They are constructed of 2 main components, and insulating housing and an electrically conducting contact. The liquid crystal polymer insulators are molded and the contacts are a bundled gold-plated molybdenum wire. Gold plated copper spacers are used for long Z-axis connectors.

CIN::APSE

CIN::APSE Positioning

CIN::APSE positioning is designed into the insulating housing. Insulation housing are molded for high volume and machined for prototypes.

CIN::APSE

CIN::APSE Mounting

CIN::APSE connectors are positioned and mounted between boards and components using generally available alignment and compression hardware. Hardware can be press fit into PBC or utilized with a bolster plate for maintaining even compression across a large socket. Designers recommend PCB layout for gold plated pads and alignment holes locations.

CIN::APSE® Products

CIN::APSE® PCB Compression Stacking Connectors

CIN::APSE® Stacking Connectors

Cinch CIN::APSE stacking connectors are used for connecting PCB or flex PCB to PCB or component to PCB without the use of solder. The contacts are compact with a pitch of 0.025". Each pathway on the CIN::APSE connector relies on a spring-like contact that establishes a durable electrical connection using mechanical...


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Features

CIN::APSE have high density and is easily installed in two basic steps, without soldering. They are also highly customizable and very reliable. See detail features description below.

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 • Maximize SWaP (Size, Weight and Performance) for space and weight constrained designs

 • Pitch grid of 2.00 mm, 1.00 mm and 0.80 mm achievable

 • Thin profiles from 0.020” and greater

 • 2-piece design reduces additional space and weight

Solderless



 • Compression sufficient for establishes multiple points of contact, RoHS compatible

 • No thermal processing or X-ray inspection required

 • Reversible mating process for multiple cycles

Customizable

 • Design team available for mechanical drawings and product sketches

 • Prototypes available for low quantities

 • Profile thicknesses from 0.020” to 1.0”

 • 2 to 7,356 contacts have been used per connector, but no limit exists

 • IC-to-PCB, PCB-to-PCB, Flex-to-PCB, Component-to-PCB

Reliable

 • Excellent shock and vibration stability, 100 Gs shock, 20 Gs vibration

            o Customer specific application passed @ 22,000 Gs

 • Thermally stable, life and cycle testing, 5,000 hrs @ 170°C

            o Customer specific application passed @ -200°C

 • Electrically stable, > 1,000 MΩ @ 500 VDC

Applications

CIN::APSE is used in various applications such as Aerospace, Datacenters or Test Equipment. Below you can find some successful projects in which CIN::APSE products were used.

Aerospace Applications

ASIC LGA Socket in P&W Engine FADEC Engine Controller

Instrumentation

100GHz Oscilloscope

Radar

Board Interposer in AESA Radar RF Module

Satellite

Flex to PBC Connector for Radarsat Constellation RF Module

Servers

LGA Sockets for Datacom Servers

Network Switches

LGA Sockets for Optical Network Switches